Photonic Engineer - RF Photonics (Integrated Photonics Unit)

仕事内容

【Job Description】 ## About OptQC OptQC is a deep-tech startup spun out of the University of Tokyo, founded with the mission of achieving the social implementation and commercialization of "optical quantum computers." While multiple modalities exist in the quantum computing landscape, we focus on the optical quantum approach. We are confident that this method is the most suitable for practical application and widespread adoption due to its inherent scalability and seamless integration with optical communications. Through continuous research and development, we aim to balance energy efficiency with high computing power, overcome the limits of human information processing, and contribute to a sustainable society. ## Background To push the boundaries of optical quantum computing, our team leverages integrated photonics to miniaturize optical circuits, achieve unprecedented phase stability, and accelerate light detection and modulation. By harnessing enhanced light-matter interactions and efficient custom nonlinear optical processes, the Integrated Photonics unit explores next-generation photonic platforms to power our quantum architecture. ## Key Responsibilities In this role, you will lead the RF and high-speed electro-optic design of photonic integrated circuits (PICs) for optical quantum computing, bridging the electrical and optical domains. Your core focus will be the co-design of high-speed modulators, photodetectors, their RF interconnects, and the driving and readout electronics. This covers electromagnetic simulation, layout, tape-out, and high-frequency characterization. - High-Speed Electro-Optic Devices: Design traveling-wave modulators on silicon and thin-film lithium niobate (LNOI) platforms, as well as high-speed photodetectors, optimizing bandwidth, drive voltage (Vπ), velocity matching, and impedance matching. - RF Interconnect Design: Design and simulate RF transmission lines, including coplanar waveguides, GSG/GSSG electrodes and pads, transitions, terminations, and wirebond/flip-chip interconnects, using ANSYS HFSS and Keysight ADS. - Electronic–Photonic Co-design: Contribute to the design and integration of CMOS/BiCMOS drivers and transimpedance amplifiers (TIAs) with photonic devices, including signal-integrity and packaging considerations, and explore co-packaged optics (CPO) architectures that place photonic and electronic dies in close proximity to minimize RF interconnect length, loss, and power consumption. - High-Frequency Characterization: Plan and perform RF and electro-optic measurements (S-parameters, EO bandwidth, eye diagrams) and feed results back into models. ## The Role & Impact As a research-driven team, the Integrated Photonics unit offers an environment rich with creative freedom and technical versatility. You will own the high-speed electrical side of our photonic chips: from electromagnetic modelling and layout, to tape-outs with established foundries, to RF and electro-optic testing in-house. Fast, low-noise modulation and detection are essential to the speed and fidelity of our quantum architecture. Your work will define how quickly and cleanly we can control and read out light, on mature silicon platforms as well as emerging LNOI technology. 【Required Qualifications】 - Degree: Master’s or Ph.D. in one of the following fields: - Integrated photonics, optics, or photonics engineering - Physics or applied physics - Electrical/electronic engineering (RF/microwave, IC design), or a related field - Hands-on experience with RF/microwave electromagnetic and circuit simulation, especially ANSYS HFSS and Keysight ADS. - Experience designing high-speed silicon and/or LNOI modulators and/or high-speed photodetectors. - Solid understanding of RF transmission line theory and the design of coplanar waveguides and GSG/GSSG electrode and probe-pad configurations, including impedance matching, RF loss, and velocity matching. - Experience in CMOS/BiCMOS circuit design (e.g., modulator drivers, TIAs) or in electronic–photonic co-design. - 2+ years of practical experience in RF photonics or high-speed electro-optic device design (including research during Master’s/Ph.D. programs). - Project Execution: Ability to independently drive design tasks from specification to tape-out and testing, and to coordinate with foundries, packaging vendors, and internal teams. 【Preferred Qualifications】 - Experience with high-frequency measurement equipment (VNA, high-speed oscilloscope/BERT, RF probe station) and calibration/de-embedding techniques. - Experience with Cadence Virtuoso or similar IC design environments and tape-outs in CMOS, BiCMOS, or SiGe processes. - Knowledge of RF packaging (wire bonding, flip-chip, interposers) and signal integrity, or experience with co-packaged optics (CPO) and 2.5D/3D electronic–photonic integration. - Experience with optical/electro-optic simulation (e.g., Lumerical, COMSOL) for modulator design. - Publications in peer-reviewed journals or conferences. -

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